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Properties of Boron Nitride (B x N y ) Films Produced by the Spin‐Coating Process of Polyborazine
Author(s) -
Kho JoongGon,
Moon KyoTae,
Kim JongHee,
Kim DongPyo
Publication year - 2000
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2000.tb01615.x
Subject(s) - boron nitride , materials science , nanoindentation , dielectric , boron , nitride , spin coating , thermal conductivity , composite material , elastic modulus , coating , analytical chemistry (journal) , layer (electronics) , chemistry , optoelectronics , organic chemistry , chromatography
Boron‐rich boron nitride (BN) films have been prepared on Si and SiO 2 /Si substrates by the vacuum pyrolysis of spin‐coated polyborazine films. Physical properties of the prepared films such as film strength, thermal conductivity, and dielectrics were determined. The BN films vacuum‐pyrolyzed at 900°C showed residual N–H bonds with a 0.75 N/B ratio, interdiffusion phenomena, and preferred orientation at the interfacial zone. Hardness and the elastic modulus of the film increased to 1.6 GPa and 50 GPa by nanoindentation loading. It had a thermal conductivity of 134 W/(m·K) at 296.5 K, and a dielectric constant in the range of 5–7, with tan ∂ between 0.01 and 0.47, depending on the film thickness.