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Reaction‐Bonded and Superplastically Sinter‐Forged Silicon Nitride–Silicon Carbide Nanocomposites
Author(s) -
Kondo Naoki,
Suzuki Yoshikazu,
Ohji Tatsuki
Publication year - 2000
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2000.tb01471.x
Subject(s) - materials science , superplasticity , nanocomposite , microstructure , silicon nitride , silicon carbide , fracture toughness , composite material , metallurgy , carbide , forging , silicon
Silicon nitride–silicon carbide (Si 3 N 4 –SiC) nanocomposites were fabricated by a process involving reaction bonding followed by superplastic sinter‐forging. The nanocomposites exhibited an anisotropic microstructure, in which rod‐shaped, micrometer‐sized Si 3 N 4 grains tended to align with their long axes along the material‐flow direction. SiC particles, typically measuring several hundred nanometers, were located at the Si 3 N 4 grain boundaries, and nanosized particles were dispersed inside the Si 3 N 4 grains. A high bending strength of 1246 ± 119 MPa, as well as a high fracture toughness of 8.2 ± 0.9 MPa·m 1/2 , was achieved when a stress was applied along the grain‐alignment direction.