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Wick Debinding of Molybdenum‐Silicon‐Boron Extrudates
Author(s) -
Summers Eric M.,
Akinc Mufit
Publication year - 2000
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2000.tb01447.x
Subject(s) - die swell , materials science , boron , molybdenum , composite material , extrusion , viscosity , pellet , capillary action , silicon , metallurgy , chemistry , organic chemistry
Wick debinding was investigated as possible means of binder removal for the Mo‐Si‐B extrudates. With increased temperature the amount of binder wicked out of the extrudate increased because of a decrease in viscosity, 2513 mPa·s at 75°C down to 7 mPa·s at 250°C. The permeability of the binder in the 1 μm wicking powder was higher than that in the 0.05 μm powder, 3.1 × 10 −13 m 2 compared to 6.024 × 10 −15 m 2 . The amount of binder removed at a given temperature was considerably lower, which could be attributed to the larger capillary pressure difference between the 0.05 μm wick and the extrudate (1.55 × 10 5 Pa compared to 1.46 × 10 4 Pa for the 1 μm powder). Wicking removed approximately 80% of the binder in <10 h at 250°C with no defect formation.