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Thermal Conductance of Delamination Cracks in a Fiber‐Reinforced Ceramic Composite
Author(s) -
McDonald Kathleen R.,
Dryden John R.,
Majumdar Arun,
Zok Frank W.
Publication year - 2000
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2000.tb01233.x
Subject(s) - materials science , composite material , conductance , composite number , ceramic , thermal conductivity , delamination (geology) , bridging (networking) , fissure , thermal , geology , thermodynamics , paleontology , computer network , physics , computer science , subduction , tectonics , mathematics , combinatorics
The thermal conductance of delamination cracks in a unidirectionally reinforced ceramic composite is investigated. A phase‐sensitive photothermal technique is used to measure the crack conductance in situ under load. Special emphasis is given to the effects of the local crack opening displacement (δ). A crack conductance model that considers the contributions from both the air and the fibers within the crack is developed and compared with the measurements. Despite considerable scatter in the experimental data, the model adequately predicts the increased conductance that is associated with fiber bridging, as well as the overall trend that is observed with δ.