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Probabilistic Thermal‐Shock Strength Testing Using Infrared Imaging
Author(s) -
Wereszczak Andrew A.,
Scheidt Rebecca A.,
Ferber Mattison K.,
Breder Kristin
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb02285.x
Subject(s) - thermal shock , weibull distribution , materials science , composite material , shock (circulatory) , infrared , ceramic , fracture (geology) , thermal , aluminium , optics , mathematics , thermodynamics , physics , medicine , statistics
A thermal‐shock strength‐testing technique has been developed that uses a high‐resolution, high‐temperature infrared camera to capture a specimen's surface temperature distribution at fracture. Aluminum nitride (AlN) substrates are thermally shocked to fracture to demonstrate the technique. The surface temperature distribution for each test and AlN's thermal expansion are used as input in a finite‐element model to determine the thermal‐shock strength for each specimen. An uncensored thermal‐shock strength Weibull distribution is then determined. The test and analysis algorithm show promise as a means to characterize thermal shock strength of ceramic materials.