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Micromechanical Characterization of Electrophoretic‐Deposited Green Films
Author(s) -
Formento Alessandra,
Montanaro Laura,
Swain Michael V.
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb02275.x
Subject(s) - materials science , indentation , composite material , radius , elastic modulus , nanoindentation , contact angle , modulus , contact area , contact mechanics , thermodynamics , finite element method , physics , computer security , computer science
Low‐load indentation experiments have been performed on electrophoretic‐deposited films of SiC particles on a graphite substrate. Films with thicknesses between 60 and 300 µm prepared at two current intensities and subsequently dried under different humidities were indented with spherical indenters with nominal radii of 10, 50, and 150 µm. Force‐displacement data were analyzed to determine contact pressure and elastic modulus versus depth results. The modulus and contact pressure behavior with depth exhibited opposite trends with indenter radius: the modulus increase was least for the 10 µm and greatest for the 150 µm, whereas the contact pressure was the inverse. The results may be rationalized by plotting modulus normalized to the ratio “contact radius/film thickness” ( a / t ), whereas the contact pressure results at small a / t could be normalized when plotted versus contact strain, i.e., contact radius divided by indenter radius ( a / R ). These approaches enabled the properties of the variously deposited films to be compared. Additional interesting microstructural and cracking behavior patterns are also reported.