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Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System
Author(s) -
Diemer Matthias,
Neubrand Achim,
Trumble Kevin P.,
Rödel Jürgen
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb02163.x
Subject(s) - wetting , copper , partial pressure , contact angle , oxygen , dissolution , adsorption , materials science , chemical engineering , bar (unit) , chemistry , metallurgy , composite material , organic chemistry , physics , meteorology , engineering
The influence of oxygen on the wetting behavior of copper on single‐crystal Al 2 O 3 has been studied. By controlling the oxygen partial pressure ( p O2 ) and oxygen content in the copper simultaneously, contact angle can be varied between 125° and 22°. Evaluation of the Gibbs adsorption equation for the liquid/solid interface at 1300°C suggests that adsorption of a Cu‐O complex at that interface plays a key role in promoting wetting. Formation of CuAlO 2 and dissolution of Al 2 O 3 in the melt also influence the contact angle, especially in the range of p O2 > 10 −5 bar (1 Pa).