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High‐Resolution Electron Microscopy Investigation of Viscous Flow Creep in a High‐Purity Silicon Nitride
Author(s) -
Jin Qiang,
Wilkinson David S.,
Weatherly George C.
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb01946.x
Subject(s) - creep , materials science , intergranular corrosion , amorphous solid , silicon nitride , composite material , transmission electron microscopy , deformation (meteorology) , silicon , nitride , metallurgy , microstructure , crystallography , nanotechnology , chemistry , layer (electronics)
The redistribution of intergranular amorphous films during creep deformation of Si 3 N 4 has been studied by high‐resolution transmission electron microscopy. The film thickness distribution of a high‐purity Si 3 N 4 material before and after creep was measured. A narrow range of film widths in the uncrept material and a bimodal distribution after creep were observed. These observations provided convincing evidence of the occurrence of viscous flow of intergranular amorphous films during creep deformation of Si 3 N 4 . Moreover, the creep response predicted by a viscous flow model was in good agreement with experimental data.