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Localized Surface Modification of Low‐Thermal‐Conductivity Brittle Solids
Author(s) -
Umezu Yuya,
Lehman Richard L.,
Wagner Jeff,
Biswas Prasenjit,
Murnick Daniel E.
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb01934.x
Subject(s) - materials science , thermal conductivity , brittleness , composite material , fuse (electrical) , surface modification , thermal , heat transfer , mechanical engineering , mechanics , thermodynamics , physics , electrical engineering , engineering
A new method utilizing temporal and spatial control of a CO 2 laser beam to generate temperatures sufficient to melt and fuse a vitreous material without concomitant development of crack‐inducing thermal gradients has been developed for the localized surface modification and repair of small manufacturing defects in brittle and low‐thermal‐conductivity solids. Heat transfer and mechanical modeling of the process have allowed development of specialized heating algorithms. Low‐positive‐expansion frits with low glass transition temperature also have been developed that enable rapid treatment of small areas without the generation of parasitic critical stresses.