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Novel Processing for Mesoporous Silica Films with One‐Dimensional Through Channels Normal to the Substrate Surface
Author(s) -
Kondoh Shinji,
Iwamoto Yuji,
Kikuta Koichi,
Hirano Shinichi
Publication year - 1999
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1999.tb01744.x
Subject(s) - materials science , amorphous solid , mesoporous material , hematite , chemical engineering , mesoporous silica , substrate (aquarium) , isotropic etching , eutectic system , adsorption , oxidizing agent , isothermal process , etching (microfabrication) , nanotechnology , mineralogy , composite material , crystallography , chemistry , microstructure , metallurgy , layer (electronics) , oceanography , engineering , catalysis , organic chemistry , geology , biochemistry , thermodynamics , physics
Mesoporous silica films with one‐dimensional through channels perpendicular to the substrate surface have been fabricated successfully by a novel process, which was a combination of eutectic decomposition of amorphous films and subsequent chemical etching. In the case of the Fe–Si–O system, amorphous precursor films annealed under oxidizing conditions were decomposed to a regular array of needlelike hematite (Fe 2 O 3 ) crystals with a diameter of ∼4 nm surrounded by an amorphous silica matrix. Then, hematite crystals were preferentially removed by chemical etching. The pore surface areas of the remaining mesoporous SiO 2 films were found to be more than 1000 m 2 /g by an isothermal N 2 gas adsorption and desorption measurement.