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Simulation of Cold Compaction Densification Behavior of Silicon Nitride Ceramic Powder
Author(s) -
Sun XueKun,
Kim KiTae,
Wang GuoDong
Publication year - 1998
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1998.tb02774.x
Subject(s) - silicon nitride , compaction , ceramic , materials science , yield (engineering) , composite material , ceramic matrix composite , matrix (chemical analysis) , stress (linguistics) , silicon , metallurgy , linguistics , philosophy
The cold‐compaction densification behavior of silicon nitride (Si 3 N 4 ) ceramic powder was analyzed using two models: the Shima model and the Cam‐Clay model. Triaxial‐compression experimental data were used to evaluate these two models. Shima models that used Si 3 N 4 matrix material with different yield stresses were discussed. It is clear that the Cam‐Clay model can effectively simulate the cold‐compaction densification behavior of Si 3 N 4 ceramic powder. The Shima model that used a very high yield stress for the Si 3 N 4 matrix material slightly overestimated the experimental data, and the Shima model that used the actual yield stress for Si 3 N 4 matrix material largely overestimated that data.