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Threshold Stress in Creep of Alumina‐Silicon Carbide Nanocomposites
Author(s) -
Ohji Tatsuki,
Kusunose Takafumi,
Niihara Koichi
Publication year - 1998
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1998.tb02682.x
Subject(s) - creep , materials science , silicon carbide , nucleation , stress (linguistics) , composite material , nanocomposite , carbide , diffusion creep , grain boundary , ultimate tensile strength , stress relaxation , microstructure , thermodynamics , linguistics , philosophy , physics
Tensile creep and the creep ruptures of an alumina‐17 vol% silicon carbide nanocomposite at 1200°C were investigated, with a particular interest in the behaviors at low applied stresses. At stresses of <50 MPa, the creep rates were remarkably decayed and the creep lives were substantially prolonged, which suggested the presence of a threshold stress, below which creep stopped, in the creep of the nanocomposite. The stress was estimated to be in the range of 20–35 MPa. This threshold stress was in agreement with that predicted from another model where the motion of grain‐boundary dislocations that were responsible for vacancy nucleation and annihilation was considered to be pinned by hard particles.