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Effect of Incidence Angle on the Impact‐Wear Behavior of Silicon Nitride
Author(s) -
Zanoria Elmer S.,
Blau Peter J.
Publication year - 1998
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1998.tb02425.x
Subject(s) - materials science , silicon nitride , composite material , delamination (geology) , nitride , layer (electronics) , paleontology , subduction , tectonics , biology
Experiments were conducted by repeatedly hammering a silicon nitride (Si 3 N 4 ) ball on a polished different Si 3 N 4 material at different incidence angles: 45°, 60°, 75°, and 90°. Material removal during impact was dominated by the delamination process, which involved abrasion and fracturing of the parent material, compaction of pulverized debris into a film, nucleation of cracks along the film/substrate interface, and lateral propagation of the interfacial cracks. The dependency of repeated impact wear on the incidence angle involved a combination of the effects of normal and tangential stresses on surface deformation. The contrasting influences of these stresses resulted in a minimization of impact wear of the polished Si 3 N 4 material at incidence angles in the range of 60°‐75°.