Technical Cost Framework for High‐Temperature Manufacturing of Small Components and Devices | Zendy

Evans Anthony G. | Zendy; Hutchinson John W. | Zendy; Hutchinson Robert G. | Zendy; Sugimura Yuki | Zendy; Lu Tian Jian | Zendy

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Technical Cost Framework for High‐Temperature Manufacturing of Small Components and Devices

Author(s) -

Evans Anthony G.,

Hutchinson John W.,

Hutchinson Robert G.,

Sugimura Yuki,

Lu Tian Jian

Publication year - 1998

Publication title -

journal of the american ceramic society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.9

H-Index - 196

eISSN - 1551-2916

pISSN - 0002-7820

DOI - 10.1111/j.1151-2916.1998.tb02416.x

Subject(s) - minification , process (computing) , function (biology) , process engineering , computer science , reliability engineering , manufacturing engineering , engineering , evolutionary biology , biology , operating system , programming language

The high‐temperature step that is required in a manufacturing process can contribute substantially to the cost. A technical cost framework (TCF) that allows trends in these costs to be determined as a function of the essential variables provides opportunities for their minimization. The basic variables are the furnace capacity, the operating temperature, and the furnace construction. The dependent variables are power, acquisition, and replacement. Information from thermal and process models as well as the furnace element life expectancy provides the functions needed to conduct the minimization through the TCF. The overall strategy is developed and illustrated with examples.

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