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Morphological Effects of Grinding on Bismuth‐Based Cuprate Superconductors
Author(s) -
Kusano Yoshihiro,
Takada Jun,
Fukuhara Minoru,
Doi Akira,
Ikeda Yasunori,
Takano Mikio
Publication year - 1998
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1998.tb02318.x
Subject(s) - bismuth , grinding , transmission electron microscopy , cuprate , superconductivity , cleavage (geology) , materials science , phase (matter) , electron microscope , high resolution transmission electron microscopy , crystallography , nanotechnology , composite material , condensed matter physics , chemistry , metallurgy , doping , optics , optoelectronics , fracture (geology) , physics , organic chemistry
Morphological changes of bismuth‐based cuprate superconductors, such as the 2223 phase, via a small mechanical force were studied mainly by means of high‐resolution transmission electron microscopy and atomic force microscopy. Even light mechanical grinding of the sintered 2223 samples led to the formation of superfine particles that had a width of ∼5 nm. Moreover, we found first that the superfine particles had a discrete thickness of odd numbers of a half unit length c /2 of the 2223 phase, e.g. 1.9 nm, 5.6 nm, and so on. The formation of the superfine particles was due to cleavage at Bi—O double layers that were bound weakly to each other in a unit cell.