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Surface Properties of Ceramic Laminates Fabricated by Die Pressing
Author(s) -
Wang Hui,
Hu Xiaozhi
Publication year - 1996
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1996.tb08167.x
Subject(s) - materials science , composite material , ceramic , pressing , die (integrated circuit) , layer (electronics) , hot pressing , indentation hardness , substrate (aquarium) , residual stress , surface layer , cubic zirconia , fracture (geology) , microstructure , nanotechnology , oceanography , geology
The simple die‐pressing technique has been used to fabricate thick‐layer zirconia/alumina ceramic laminates in the forms of film/substrate and multilayer systems. A “vibration sieve” method is used to achieve uniform layer thickness. In order to suppress surface crack initiation and propagation, the laminates are designed to retain residual compressive stresses in the surface layers. As a result, the surface fracture/fatigue resistance has been significantly improved, and the microhardness of the surface layer has also been increased to a certain degree.