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Dynamic Recrystallization during the Sliding Wear of Alumina at Elevated Temperatures
Author(s) -
Xiao Hanning,
Senda Tetsuya,
Yasuda Eiichi
Publication year - 1996
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1996.tb08101.x
Subject(s) - materials science , grain size , dynamic recrystallization , recrystallization (geology) , surface layer , composite material , metallurgy , microstructure , layer (electronics) , hot working , paleontology , biology
In previous studies, a very fine grain size surface layer of several micrometer thickness has been consistently observed in the wear track of alumina couples after wear at elevated temperatures. Detailed microstructural observations have revealed that dynamic recrystallization is the most probable mechanism for the surface layer formation. In this study, grain size and thickness of the surface layer are reported for the samples tested under various wear conditions. Both the grain size and the thickness are dependent on the testing temperature, nominal contact pressure, and the sliding velocity. The strain rate and the local temperature of the wear surface are estimated taking frictional heat into account and the Zener‐Hollomon parameter Z = exp( Q/RT ) is calculated. A logarithmic plot of the grain size and Z yields a good linear relationship. This linearity and the slope of –0.21, similar to that previously reported for metals, further substantiate that dynamic recrystallization occurring in the wear surface is responsible for the formation of the fine grain size surface layer