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Strength and Microstructure of Silicon Nitride Ceramics Brazed with Nickel‐Chromium‐Silicon Alloys
Author(s) -
Hadian Ali Mohammad,
Drew Robin A. L.
Publication year - 1996
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1996.tb07926.x
Subject(s) - brazing , materials science , ceramic , silicon nitride , microstructure , metallurgy , chromium , silicon , filler metal , nickel , layer (electronics) , residual stress , composite material , alloy , welding , arc welding
Joining of sintered Si 3 N 4 was performed using a high‐temperature brazing technique. Ni‐based brazing alloys having the same Ni:Cr ratio as AWS BNi‐5 (Ni·18Cr·19Si (at. %)) but different Si content were used as the brazing filler metals. Joining experiments were performed at 1220°C under a N 2 partial pressure of 15 Pa for different times between 5 to 15 min. The highest room‐temperature four‐point bend strength of the joints was 115 MPa, whereas 220 MPa was achieved when the joints were tested at 900°C. The high strength of the experimental joints was attributed to the reduction in residual stresses and formation of a CrN reaction layer at the ceramic/filler metal interface.