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Wetting in an Electronic Packaging Ceramic System: II, Wetting of Alumina by a Silicate Glass Melt under Controlled p O2 Conditions
Author(s) -
Weirauch Douglas A.,
Lazaroff Jerold E.,
Ownby P. Darrell
Publication year - 1995
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1995.tb09065.x
Subject(s) - contact angle , wetting , sessile drop technique , materials science , dissolution , partial pressure , drop (telecommunication) , surface energy , isothermal process , ceramic , composite material , oxygen , mineralogy , chemical engineering , chemistry , thermodynamics , telecommunications , physics , organic chemistry , computer science , engineering
The wetting of polycrystalline alumina by a colored, calciamagnesia aluminosilicae glass was found to be dependent on temperatutre between 1300° and 1500°C, but independent of gas atmosphere effects. Neither the oxygen partial pressure, oveer the range of 10 ‐6 to 10 ‐10 Pa, the gas buffer system (Co/CO 2 or H 2 /H 2 O), nor pre‐equilibration of the substrate surface with the atmosphere at tge exoperimental temperature before solid‐liuid interface formation affected the stable contact angle. An initial drop in contact angle the stable contact angle. An initial drop in contact angle occurring within the first hour is attributed to repaid dissolution of alumina and the formation of a stable glass/alumina interface. The contact angle after an 8‐h isothermal hold decreased from 1300° to 1500°C. The solid‐liquid interfacial energy, μM S1 , controls the wetting behavior. Changes in μM s1 are attributed to he breakup of the silica network as temperature increases.