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Thermal Stresses in Ceramic‐Metal Joints with an Interlayer
Author(s) -
Munz Dietrich,
Sckuhr Matthias A.,
Yang Yingyuan
Publication year - 1995
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1995.tb08798.x
Subject(s) - materials science , ceramic , composite material , thermal expansion , thermal , enhanced data rates for gsm evolution , metal , stress (linguistics) , field (mathematics) , stress field , metallurgy , structural engineering , thermodynamics , finite element method , telecommunications , linguistics , philosophy , physics , computer science , mathematics , pure mathematics , engineering
The stresses near the free edge of the interface in joints of dissimilar materials with an interlayer were analyzed after a change in temperature. The effects of the thickness of the interlayer and of the material properties (elastic constants, thermal expansion coefficients) on the singular stress field are discussed.