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Processing of 1‐3 Piezoelectric Ceramic/Polymer Composites
Author(s) -
Janas Victor F.,
McNulty Thomas F.,
Walker Francis R.,
Schaeffer Robert E,
Safari Ahmad
Publication year - 1995
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1995.tb08680.x
Subject(s) - materials science , composite material , wafer dicing , ceramic , tape casting , piezoelectricity , composite number , honeycomb , casting , polymer , fiber , stack (abstract data type) , honeycomb structure , layer (electronics) , computer science , programming language
Several methods of forming fine‐scale 1–3 piezoelectric ceramic/polymer composites for possible transducer applications were demonstrated. These methods include tape casting, honeycomb dicing, and ceramic fiber weaving. In the tape casting technique, laminated structures were formed using thin PZT tapes. The tapes were stacked, with spacers separating the layers, and the stack embedded in polymer. Dicing the stack resulted in a composite with 1–3 connectivity. The thin tape technique can be used to develop composites with ceramic or polymer volume fraction gradients and multifunctional ceramics. Dicing of PZT honeycombs yields 1–3 composites with uniquely shaped rods. Shapes included +, T, and L. In the ceramic fiber weaving technique, green PZT fibers were woven through a PZT honeycomb support structure. The structure was fired to sinter the PZT fibers, and embedded with polymer to yield 1–3 composites. All 1–3 composites showed high and uniform piezoelectric coefficients across the electroded area.