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Microstructure and Reactions of SiC w ‐Reinforced Alumina with Ag‐Cu‐In‐Ti
Author(s) -
Park EunSung,
Lannutti John J.,
Cawley James D.
Publication year - 1995
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1995.tb08355.x
Subject(s) - whiskers , materials science , whisker , microstructure , eutectic system , brazing , layer (electronics) , oxide , alloy , composite material , stacking , composite number , metal , metallurgy , chemistry , organic chemistry
Brazing experiments were performed at 750°C for 2 h between Ag–Cu–In–Ti alloy and SiC w /Al 2 O 3 . The first clearly nonbraze layer consists of an oxide layer of metallic composition 33Ti–31Al–22Cu–14Si. Areas adjacent to the SiC whiskers were of different composition. A thin, continuous layer on the alumina portion of the composite appears to be γ‐TiO. The SiC whiskers are preferentially consumed and undergo reductions in diameter of approximately 40%. Observed “knobby” whisker morphologies may be related to SiC stacking faults, η‐type phases detected near the Ag–Cu eutectic portion of the joint appear to consist of Ti‐Cu‐Al‐Si‐O and Ti 3 Cu 3 O.