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Microstructure Effects in Multidipped Tin Oxide Films
Author(s) -
Park SungSoon,
Mackenzie John Douglas
Publication year - 1995
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1995.tb08038.x
Subject(s) - microstructure , materials science , scanning electron microscope , coating , tin , tin oxide , auger electron spectroscopy , particle size , electrical resistivity and conductivity , oxide , metallurgy , composite material , chemical engineering , physics , electrical engineering , nuclear physics , engineering
Porous ultrafine tin oxide films (particle size 70–90 Å) have been prepared from tin alkoxide by dip coating. The influence of the number of coating applications on the thickness, microstructure, and electrical properties of multidipped tin oxide films was investigated. With an increase in the number of coating applications, the porosity of the multidipped films decreased from 60% to 12%, but the particle size of the films increased. The resistivity of the films decreased from 5.5 × 10 –2 to 5.7 × 10 –3 Ω·cm with increasing the number of coating applications from 1 to 10. This tendency of the resistivity to decrease is due to the microstructural change of the films with the number of coating applications. The microstructure, the surface structure, and the composition of the multidipped films were investigated by scanning electron microscopy (SEM), X‐ray diffraction (XRD), and Auger electron spectroscopy (AES).