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Residual Stresses in Polycrystalline Diamond Compacts
Author(s) -
Lin TzePin,
Hood Michael,
Cooper George A.,
Smith Redd H.
Publication year - 1994
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1994.tb09757.x
Subject(s) - materials science , diamond , tungsten carbide , sintering , residual stress , composite material , ultimate tensile strength , radial stress , tungsten , carbide , compressive strength , layer (electronics) , crystallite , metallurgy , deformation (meteorology)
The effects of residual stress on the integrity of polycrystalline diamond compact (PDC) cutters was investigated. When the compact cooled from the sintering temperature to room temperature, very high radial compressive stresses were induced in the diamond table, and (generally) much lower radial tensile stresses were induced in the cemented tungsten carbide backing. The magnitudes of these residual stresses were not affected very much by the diameter of the compact. However, the residual stresses were affected significantly by the thickness ratio of the carbide layer to the diamond layer. The higher this ratio the greater was the radial compressive stress in the diamond and the lower was the radial tensile stress in the carbide. This same effect was obtained by sintering a relatively thin layer of tungsten carbide on top of the diamond table.