Premium
Role of Oxygen in Microstructure Development at Solid‐State Diffusion‐Bonded Cu/α‐Al 2 O 3 Interfaces
Author(s) -
Rogers Kirk A.,
Trumble Kevin P.,
Dalgleish Brian J.,
Reimanis Ivar E.
Publication year - 1994
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1994.tb07094.x
Subject(s) - microstructure , materials science , foil method , grain boundary , oxygen , optical microscope , scanning electron microscope , analytical chemistry (journal) , torr , diffusion , crystallography , metallurgy , mineralogy , composite material , chemistry , physics , organic chemistry , chromatography , thermodynamics
Microstructure development at solid‐state diffusion‐bonded Cu/α‐Al 2 O 3 interfaces has been studied using optical and electron microscopy. High‐purity Cu foil was bonded between basal‐oriented α‐Al 2 O 3 single‐crystal plates at 1040°C for 24 h in a vacuum of ∼1.3 × 10 −4 Pa (1 × 10 −6 torr). Optical microscopy of as‐bonded specimens revealed a large Cu grain size, fine pores, and long needles of Cu 2 O at the interface. Bulk specimens were annealed at 1000°C for various times under controlled oxygen partial pressures in CO/CO 2 mixtures. Consistent with a thermochemical analysis, CuAlO 2 could be formed at the interfaces. The CuAlO 2 was acicular and discontinuous, but occurred in a uniform distribution over the bulk specimen interfaces.