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Piezospectroscopic Determination of Residual Stresses in Polycrystalline Alumina
Author(s) -
Ma Qing,
Clarke David R.
Publication year - 1994
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1994.tb06996.x
Subject(s) - materials science , residual stress , crystallite , grain boundary , grain size , anisotropy , impurity , aluminium , residual , grain boundary diffusion coefficient , composite material , metallurgy , mineralogy , microstructure , chemistry , optics , mathematics , physics , organic chemistry , algorithm
The residual stresses created in polycrystalline aluminum oxide as a result of its constrained anisotropic thermal contraction are measured with the technique of piezospectroscopy using the fluorescence from trace Cr 3+ impurities. The average residual stresses in the crystallographic a and c directions are determined as a function of grain size for a high‐purity alumina, as is the width of the stress distribution (assuming it to be Gaussian). Over the range of grain sizes investigated, from 2 to 16 μm, the residual stresses exhibit a dependence on grain size consistent with the prediction of the Evans‐Clarke model of thermal stress relaxation by grain boundary diffusion.