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Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part II, Creep Rate Behavior
Author(s) -
Me Mamballykalathil N.,
Fang Ho T.,
Wu David C.,
Jenkins Michael G.,
Ferber Mattison K.
Publication year - 1994
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1994.tb05396.x
Subject(s) - creep , materials science , silicon nitride , stress (linguistics) , composite material , ultimate tensile strength , diffusion creep , activation energy , phenomenological model , atmospheric temperature range , silicon , thermodynamics , metallurgy , condensed matter physics , microstructure , grain boundary , chemistry , physics , linguistics , philosophy
In Part I of this paper, experimental observations on creep testing of 74 tensile specimens of an advanced silicon nitride were presented. In this part, equations are developed for predicting creep rates in the primary and secondary regimes in the temperature range 1477–1673 K. The resulting model predicts creep strain rates to within a factor of two. The underlying phenomenological basis, which employs an activation energy approach, is discussed. The mechanisms that are likely to be responsible for the transiency of the primary creep regime and for the unique stress and temperature dependencies of the creep rates are explored.