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Anomalous Temperature Dependence of Cyclic Fatigue‐Crack Growth in a Silicon Carbide Matrix Composite
Author(s) -
Yao Daping,
Shang JianKu
Publication year - 1994
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1994.tb04523.x
Subject(s) - materials science , composite material , activation energy , silicon carbide , crack closure , crack growth resistance curve , arrhenius equation , tension (geology) , composite number , growth rate , grain boundary , paris' law , oxide , fracture mechanics , compression (physics) , microstructure , metallurgy , chemistry , geometry , mathematics , organic chemistry
Fatigue‐crack growth behavior under cyclic tension‐tension loading has been examined in a 30‐vol%‐TiB 2 ‐reinforced β‐SiC matrix composite, using compact tension specimens tested at temperatures from 750° to 850°C in a furnace air environment. Cyclic fatigue‐crack growth rate was found to depend strongly on testing temperature and was faster at a lower temperature. Such an anomalous dependence of crack growth rate on temperature is shown to result from the reduction in crack growth driving force, Δ K , by the wedging action of the oxide film formed behind the crack tip. Subtraction of the contribution from oxide films leads to a “normal” Arrhenius relation between cyclic crack growth rate and temperature, with the activation energy equal to that for the viscous flow of grain boundary phase.