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Temperature Dependence of Anelastic Deformation in Polycrystalline Silicon Nitride
Author(s) -
Sato Kazunori,
Tanaka Kohichi,
Nakano Yoshinori,
Mori Tsutomu
Publication year - 1993
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1993.tb08330.x
Subject(s) - materials science , grain boundary , grain boundary sliding , deformation (meteorology) , silicon nitride , composite material , brittleness , viscoplasticity , bending , modulus , crystallite , stress (linguistics) , flow stress , silicon , metallurgy , thermodynamics , constitutive equation , strain rate , finite element method , microstructure , physics , linguistics , philosophy
The influence of grain‐boundary sliding on the evaluation of the apparent Young's modulus and plastic‐deformation (flow) stress was investigated by bending tests for two types of silicon nitrides sintered with Y 2 O 3 ‐based additives The apparent Young's moduli measured at high temperatures are consistent with those predicated from a theory based on polycrystalline anelasticity due to grain‐boundary sliding. The temperature dependence of the critical bending stress for the onset of plastic deformation shows viscoplastic properties of the interglanular glass. The ductile‐to‐brittle transition of fracture is discussed by the bending strengths normalized by the measured Young's modulus.