Premium
Flexural Stress Rupture and Creep of Selected Commercial Silicon Nitrides
Author(s) -
Sanders William A.,
Groseclose Lance E.
Publication year - 1993
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1993.tb03826.x
Subject(s) - creep , flexural strength , materials science , stress (linguistics) , composite material , microstructure , silicon nitride , ultimate tensile strength , deformation (meteorology) , cracking , silicon , metallurgy , philosophy , linguistics
Four commercial Si 3 N 4 compositions were compared with regard to flexural stress rupture and creep in ambient air as functions of temperature from 1100° to 1400°C and stress from 200 to 350 MPa. One Si 3 N 4 , SN252, was found to be more resistant to time‐dependent deformation in both stepped‐temperature stress rupture tests and creep tests than a very similar Si 3 N 4 composition and two other dissimilar Si 3 N 4 compositions. Materials were compared on the bases of percent final strains, creep rates, and posttest microscope examinations. The latter revealed tensile face transverse cracking, and slow crack growth. The superior behavior of the SN252 Si 3 N 4 was related to its microstructure.