Premium
Cracking due to Localized Hot Shock
Author(s) -
Tvergaard Viggo,
Xia Z. Cedric,
Hutchinson John W.
Publication year - 1993
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1993.tb03667.x
Subject(s) - cracking , materials science , thermal shock , perpendicular , shock (circulatory) , brittleness , stress field , plane (geometry) , stress intensity factor , plane stress , stress (linguistics) , mechanics , field (mathematics) , composite material , geometry , fracture mechanics , physics , thermodynamics , finite element method , mathematics , medicine , linguistics , philosophy , pure mathematics
Results are presented for the cracking to be expected when a sudden temperature increase is applied over a localized region on a surface of a brittle solid. A localized temperature increase is applied to the surface of a body whose interior is initially at uniform temperature. A three‐part analysis is conducted: (i) for the evolving temperature distribution, (ii) for the evolving thermal stresses induced by the nonuniform temperature field, and (iii) for stress intensity factors of cracks oriented either parallel to or perpendicular to the surface and initiated at times when the stresses are critical. Plane‐strain and axisymmetric versions of the problems are considered. For the plane‐strain problem, the complete trajectory of the crack is determined under the assumption that its tip advances maintaining a pure mode I field at all times. Conditions for excluding cracking due to localized hot shock are given.