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Texture and Anisotropy in Silicon Nitride
Author(s) -
Lee Farnjeng,
Bowman Keith J.
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb07192.x
Subject(s) - materials science , texture (cosmology) , fracture toughness , anisotropy , indentation , composite material , plane stress , sintering , distribution function , toughness , silicon nitride , fracture (geology) , grain growth , orientation (vector space) , compression (physics) , grain size , geometry , optics , mathematics , finite element method , structural engineering , image (mathematics) , physics , layer (electronics) , quantum mechanics , artificial intelligence , computer science , engineering
In this investigation quantitative texture analysis, including calculation of the orientation distribution function, is used to demonstrate the degree of preferred orientation in β ‐Si 3 N 4 which has been hot‐pressed or hot‐worked. The results indicate that plane strain compression can produce strong textures. The texture is decided by the processing parameters including temperature, sintering additives, and stress state. Grain rotation and preferred grain growth apparently both contribute to texture development in β ‐Si 3 N 4 . Basal (00 l ) pole figures obtained from the orientation distribution function are consistent with microstructural observations and are reflected in indentation fracture toughness anisotropy. In plane strain the ratio of maximum to minimum fracture toughness is greater than 2.