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Joining SiAlON Ceramics Using Composite β‐SiAlON–Glass Adhesives
Author(s) -
Walls Philip A.,
Ueki Masanori
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb05602.x
Subject(s) - sialon , acicular , materials science , ceramic , composite number , microstructure , adhesive , composite material , mineralogy , layer (electronics) , chemistry
Commercial β‐SiAlON ceramics were joined using mixed Si 3 N 4 , Y 2 O 3 , Al 2 O 3 , and SiO 2 powders. At a joining temperature of 1600°C and a hold time in excess of 10 min, the adhesive was converted to an approximate 60:40 vol% composite of β‐SiAlON–glass‐ceramic. The grain size of the acicular β‐SiAlON grains precipitated in the joint (submicrometer diameter, average aspect ratio of 10) was significantly smaller than those in the adherend ceramic (1–5 μm diameter). Intergrowth of β‐SiAlON grains at the joint interface resulted in high bond strengths. The chemistry and microstructure of the ceramic adhesives used are described.