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Microstructure of a Shock‐Consolidated Diamond Compact Consisting of Fine Particles
Author(s) -
Kondo Kenichi,
Sawai Sumiichi
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb05480.x
Subject(s) - microstructure , diamond , materials science , transmission electron microscopy , nanometre , thermal shock , grain boundary , shock (circulatory) , shock wave , composite material , thermal , compression (physics) , nanotechnology , mechanics , thermodynamics , physics , medicine
Transmission electron microscopy clearly demonstrates two types of grain boundaries in a shock‐consolidated diamond compact consisting of fine particles: one is thick (40 nm) and irregular, whereas the other is thin (less than a few nanometers) and straight. The former is formed during the first compression (21 GPa) while the latter is formed after passage of the first shock‐wave front. Numerical calculations describing thermal diffusion support the proposed mechanism under a multiple‐compression process.