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Fracture Toughness and Thermal Shock Behavior of Silicon Nitride–Boron Nitride Ceramics
Author(s) -
Lutz Ekkehard H.,
Swain Michael V.
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb05443.x
Subject(s) - thermal shock , materials science , fracture toughness , composite material , boron nitride , ceramic , silicon nitride , toughness , shock (circulatory) , nitride , thermal , fracture (geology) , thermodynamics , medicine , physics , layer (electronics)
Fracture toughness behavior, stress–strain behavior, and flaw resistance of pressureless‐sintered Si 3 N 4 ‐BN ceramics are investigated. The results are discussed with respect to the reported thermal shock behavior of these composites. Although the materials behave linear‐elastic and exhibit no R ‐curve behavior, their flaw resistance is different from that of other linear‐elastic materials. Whereas the critical thermal shock temperature difference (Δ T c ) is enhanced by adding BN, the content of BN has no influence on the strength loss during severe thermal shocks.