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Photoelastic Measurement of Residual Thermomechanical Stress in SiC‐Reinforced Glass Composites
Author(s) -
Krynicki Joseph W.,
Nagle Dennis C.,
Green Robert E.
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb04488.x
Subject(s) - materials science , composite material , thermal expansion , residual stress , composite number , thermomechanical analysis
Residual thermomechanical stresses in a Nicalon® SiC/7740 glass composite system were measured directly. Residual stresses for both single‐tow and two‐dimensional cloth‐reinforced samples were completely described via a digital microphotoelastic technique. Normal stresses approaching 4 MPa were observed in this composite system that had a thermal expansion coefficient mismatch of only 1.8%. The advantages of using this direct, full‐field technique over other theoretical and composite model approaches are also discussed.