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Processing and Microstructural Development of In Situ TiN‐Reinforced Silicon Nitride/Silicon Oxynitride Composites
Author(s) -
Lin Wai,
Yang JennMing,
Ting SuJen,
Ezis Andre,
Shih C. James
Publication year - 1992
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1992.tb04369.x
Subject(s) - materials science , tin , microstructure , silicon , sintering , titanium nitride , silicon nitride , composite number , silicon oxynitride , composite material , scanning electron microscope , anatase , nitride , sialon , metallurgy , layer (electronics) , photocatalysis , biochemistry , chemistry , catalysis
The development of a novel TiN‐reinforced silicon nitride/silicon oxynitride composite using an innovative in situ TiN‐forming technique was investigated. Silicon powder compacts containing various amounts of TiO 2 (anatase structure) and sintering additives were nitrided under N 2 atmosphere and then further densified by hot pressing. The microstructure of the resultant composite was analyzed by X‐ray diffraction, scanning electron microscopy, and solid‐state nuclear magnetic resonance spectroscopy. The results of this study show that TiO 2 can be successfully converted to TiN during the nitridation of Si + TiO 2 mixture. The TiO 2 content affects not only the microstructure of the matrix but also the composition of the intergranular phase. The type and amount of sintering additives also show a significant effect on the microstructural development of the composite.