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Low‐Temperature Sintering of Alumina with Liquid‐Forming Additives
Author(s) -
Xue Liang A.,
Chen IWei
Publication year - 1991
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1991.tb07825.x
Subject(s) - sintering , materials science , microstructure , dopant , ceramic , fracture toughness , doping , alumina ceramic , composite material , chemical engineering , metallurgy , optoelectronics , engineering
Simultaneous application of colloidal processing and liquid‐forming additives to alumina resulted in a sintered density of >99% in 1 h at a temperature as low as 1070°C for a commercial high‐purity alumina powder at a total dopant level of 2 mol%. The additives were 0.9% CuO + 0.9% TiO 2 + 0.1% B 2 O 3 + 0.1% MgO. At higher temperatures or after prolonged sintering, the doped alumina ceramic developed a duplex microstructure containing large elongated grains and exhibited a relatively high fracture toughness of ∼ 3.8 MPa · m 1/2 as compared to a value of ∼ 2.6 MPa · m 1/2 for the undoped alumina.