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Thermal Shock Testing of Ceramics—A New Testing Method
Author(s) -
Schneider Gerold A.,
Petzow Günter
Publication year - 1991
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1991.tb07303.x
Subject(s) - pyrometer , thermal shock , materials science , composite material , tungsten , enhanced data rates for gsm evolution , shock (circulatory) , ceramic , transient (computer programming) , thermal , fracture toughness , temperature measurement , metallurgy , thermodynamics , medicine , telecommunications , physics , computer science , operating system
The thermal shock behavior of Si 3 N 4 has been determined with a new type of computer‐controlled testing equipment. Thin circular disks are heated up to 1350°C with two tungsten halogen lamps yielding heating rates up to 1000°C/s. The sample temperature is measured in situ with an infrared pyrometer and used to calculate the transient thermal stresses. The simple geometry of radially orientated notches allows in situ observation of the crack growth behavior during thermal shock. Measured failure times are used to determine the fracture toughness of the material under thermal shock loading, K c TS , from room temperature (RT) up to 1000°C. Comparison of the results with K Ic SENB values measured by the single‐edge notch beam method at RT shows excellent agreement.