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Strength of Slip‐Cast, Sintered Silicon Nltrlde
Author(s) -
Govila Ratan K.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb09823.x
Subject(s) - flexural strength , materials science , slip (aerodynamics) , composite material , transgranular fracture , silicon nitride , intergranular corrosion , fracture mechanics , intergranular fracture , microstructure , physics , layer (electronics) , thermodynamics
The flexural strength of slip‐cast, sintered silicon nitride was evaluated as a function of temperature (20° to 1300°C in air), applied stress, and time. The flexural strength was independent of temperatures from 20° to 800°C, and the mode of crack propagation was primarily transgranular. Above 800°C, the flexural strength decreased because of viscous flow of the glassy phase present in the material resulting in subcritical crack growth (SCG). The mode of crack propagation during SCG was essentially intergranular. Flexural stress‐rupture evaluation in the temperature range 800° to 1000°C was used to identify the stress levels for time‐dependent and time‐independent failures.