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Crystal Orientation Dependence of Machning Damage–A Stress Model
Author(s) -
Blackley Winston S.,
Scattergood Ronald O.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb06730.x
Subject(s) - materials science , brittleness , diamond , limiting , crystal (programming language) , stress (linguistics) , elasticity (physics) , composite material , anisotropy , wafer , condensed matter physics , crystallography , metallurgy , optics , nanotechnology , chemistry , physics , mechanical engineering , linguistics , philosophy , computer science , engineering , programming language
The pitting damage occurring along preferred crystal orientations observed after single‐point diamond turning of brittle materials dictates a limiting feed rate at which the material can be machined. Using elasticity theory, the orientation dependence of the pitting can be qualitatively explained. Calculations based on a line‐force stress model predict the orientation dependece of the damage symmetry. The results are in good agreement with machining tests for a series of germanium single‐crystal wafers.