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Experimental Observations of Substrate Fracture Caused by Residually Stressed Films
Author(s) -
Drory Michael D.,
Evans Anthony G.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb06564.x
Subject(s) - materials science , composite material , substrate (aquarium) , residual stress , cracking , fracture (geology) , thin film , stress intensity factor , modulus , soda lime glass , diffusion , fracture mechanics , nanotechnology , oceanography , physics , geology , thermodynamics
Model systems for studying thin‐film cracking consisting of thin plates of alumina and soda‐lime glass were diffusion bonded to silica substrates at high temperature. Upon slow cooling, substrate fracture was induced by residual stresses from the thermal and elastic mismatch of the film and substrate. In particular, multiple substrate cracks formed parallel to the interface. The observed crack paths closely followed predictions based on a zero mode II stress intensity. Crack depths were found to be strongly dependent on the relative substrate thickness and the Young's modulus ratio.