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Whisker Toughening: A Comparison Between Aluminum Oxide and Silicon Nitride Toughened with Silicon Carbide
Author(s) -
Campbell Geoffrey H.,
Rühle Manfred,
Dalgleish Brian J.,
Evans Anthony G.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb06548.x
Subject(s) - whisker , whiskers , materials science , toughening , fracture toughness , composite material , silicon carbide , toughness , monocrystalline whisker , silicon nitride , bending , layer (electronics)
Two whisker‐toughened materials have been studied, with the objective of identifying the mechanisms that provide the major contribution to toughness. It is concluded that, for composites with randomly oriented whiskers, bending failure of the whiskers obviates pullout, whereupon the major toughening mechanisms are the fracture energy consumed in creating the debonded interface and the stored strain energy in the whiskers, at failure, which is dissipated as acoustic waves. The toughening potential is thus limited. High toughness requires extensive pullout and, hence, aligned whiskers with low fracture energy interfaces.