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Thermal Diffusivity/Conductivity of Alumina—Silicon Carbide Composites
Author(s) -
McCluskey Philip H.,
Williams Robert K.,
Graves Ron S.,
Tiegs Terry N.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb06538.x
Subject(s) - thermal diffusivity , laser flash analysis , thermal conductivity , materials science , thermal conductivity measurement , whisker , composite material , silicon carbide , atmospheric temperature range , thermal transmittance , whiskers , thermal , thermodynamics , thermal resistance , physics
Thermal diffusivity and conductivity values for several Al 2 O 3 ‐SiC whisker composites were determined. The thermal diffusivity values spanned the range from 373 to 1473 K, and thermal conductivity data wre obtained between 305 and 365 K. The thermal diffusivity decreased with increasing temperature and increased with SiC‐whisker content. An estimate of the thermal conductivity of the whiskers was obtained from the direct thermal conductivity measurements, but attempts to derive whisker conductivity values from the thermal diffusivity data were not successful because the laser flash method lacks the required accuracy and precision. Specimens were subjected to two different thermal quench experiments to investigate the effect of thermal history on diffusivity. In the most severe case, multiple 1073‐ to 373‐K quenches, radial cracks were observed in the test specimens; however, there was no change in diffusivity. The lack of sensitivity to thermal cycling appears to be related to the sample size.