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Failure of Glass with Subthreshold Flaws
Author(s) -
Choi S. R.,
Ritter J. E.,
Jakus K.
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb06505.x
Subject(s) - indentation , subthreshold conduction , materials science , inert , fracture mechanics , composite material , fracture (geology) , residual stress , fatigue testing , engineering , chemistry , organic chemistry , transistor , voltage , electrical engineering
Conventional postthreshold crack analysis cannot be used to predict the strength and fatigue behavior of glass with subthreshold flaws. Therefore, a fracture mechanics model for failure of glass with subthreshold indentation flaws was developed. This model accounts for both the near‐ and farfield residual stresses associated with the indentation impression. It is shown that these stresses play a major role in the initiation and subsequent propagation of cracks that eventually cause failure. The model predicts “pop‐in” of a well‐developed crack and failure under continuous and discontinuous crack growth in both inert and fatigue conditions. The results of experiments with bare fused silica fibers with indentation subthreshold flaws in inert and fatigue (water) environments were in good agreement with the predictions by the model.