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Effects of Electric Fields on Slow Crack Growth in Glass
Author(s) -
Caso Gary B.,
Schwabel Mark G.,
Frechette Van Derck
Publication year - 1990
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1990.tb05088.x
Subject(s) - crack closure , materials science , crack tip opening displacement , composite material , displacement (psychology) , crack growth resistance curve , electric field , plane (geometry) , closure (psychology) , electrode , fracture mechanics , chemistry , mathematics , geometry , physics , market economy , quantum mechanics , economics , psychotherapist , psychology
Electrical de fields applied through electrodes on either side of a slow‐running crack in soda‐lime‐silica glass resulted in a deviation of the crack plane and in delayed deceleration, arrest, and healing. In some cases crack closure occurred while still under load. Resumption of propagation resumed gradually upon removal of the field. It is suggested that the effects involve displacement of the dilated negatively charged zone at the crack tip, while healing is effected by reformation of bonds between the crack surfaces.