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Effect of Contact Residual Stress on Proof Testing
Author(s) -
RITTER JOHN E.,
JAKUS KARL,
SHI PING
Publication year - 1988
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1988.tb05889.x
Subject(s) - residual stress , materials science , residual , stress (linguistics) , stress intensity factor , residual strength , power law , mechanics , composite material , forensic engineering , fracture mechanics , mathematics , physics , statistics , engineering , linguistics , philosophy , algorithm
Theoretical predictions are made of strength distributions after proof testing accounting for the possibility of a contact residual stress. Assuming a simple power‐law relationship between subcritical crack velocity and the stress intensity factor, the amount of crack growth, hence strength degradation, that occurs during a proof stress cycle is determined. The results clearly show that the contact residual stress can strongly influence the after‐proof strength distribution so that after‐proof strengths can become weaker than the initial. The results are consistent with experimental observations with soda–lime glass; thus, the importance of accounting for the contact residual stress is emphasized.