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Effect of Silicon Carbide Fiber or Whisker Reinforcement on the Thermal Diffusivity/Conductivity of an Osumilite Glass‐Ceramic
Author(s) -
Johnson Lloyd F.,
Hasselman D. P. H.,
Chyung Kenneth
Publication year - 1987
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1987.tb05671.x
Subject(s) - thermal diffusivity , materials science , whisker , silicon carbide , composite material , ceramic , thermal conductivity , laser flash analysis , monocrystalline whisker , whiskers , thermal conductivity measurement , differential scanning calorimetry , fiber , carbide , thermodynamics , physics
The thermal diffusivity of silicon carbide fiber‐ and whisker‐reinforced osumilite glass‐ceramic was determined by the laser‐flash method. The thermal conductivity was calculated from the data of thermal diffusivity, density, and specific heat measured by differential scanning calorimetry. Because of the much higher thermal conductivity of the crystalline silicon carbide whiskers compared to the corresponding value for the amorphous fibers, the whisker‐reinforced composites exhibited significantly higher thermal diffusivity and thermal conductivity than the fiber‐reinforced composites.