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Static and Cyclic Fatigue Behavior of a Sintered Silicon Nitride at Room Temperature
Author(s) -
KAWAKUBO TAKASHI,
KOMEYA K.
Publication year - 1987
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1987.tb05659.x
Subject(s) - materials science , intergranular corrosion , cyclic stress , silicon nitride , composite material , transgranular fracture , fatigue limit , fractography , fracture toughness , intergranular fracture , indentation , cracking , grain boundary , fracture mechanics , microstructure , layer (electronics)
The static and cyclic fatigue behavior of sintered silicon nitride was investigated at room temperature. Flexure specimens, with an indentation‐induced flaw at the center, were tested under a static or cyclic load applied by four‐point bending. Sintered silicon nitride was shown to be susceptible to static and cyclic fatigue failure. Comparing the static and cyclic fatigue lifetimes at frequencies from 0.01 to 10 H z , it was shown that minimum time to failure was almost the same, in spite of differences in loading mode or frequency. However, cyclic stress decreased the scatter in lifetime by reducing the upper limit. Moreover, the cyclic fatigue limit was significantly lower than the static fatigue limit. High‐magnification fractography revealed a fatigue failure dominated by intergranular cracking with partial transgranular failure at perpendicularly elongated crystals. This suggests that the intergranular fatigue crack can be arrested at grain‐boundary triplets, and also can be reactivated by subsequent cyclic loading. The crack growth rate, calculated from the fatigue lifetime, showed three characteristic regions having a plateau at 70% to 90% of the fracture toughness, which suggests a possible intergranular stress corrosion cracking mechanism resembling that in glass or alumina.