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Interfacial Cracks in Ceramic‐to‐Metal Bonds under Transient Thermal Loads
Author(s) -
KOKINI KLOD
Publication year - 1987
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1987.tb04905.x
Subject(s) - ceramic , materials science , composite material , metal , transient (computer programming) , steady state (chemistry) , fracture mechanics , enhanced data rates for gsm evolution , strain energy release rate , thermal , strain energy , metallurgy , structural engineering , thermodynamics , finite element method , chemistry , telecommunications , physics , computer science , engineering , operating system
The effect of a transient thermal load on an interfacial edge crack and center crack between a ceramic‐to‐metal bond was analyzed with the use of fracture mechanics. The deformations of the crack and the strain energy release rate were calculated for the case of a ceramic layer of equal thickness to the metal, one with one‐tenth the thickness of the metal, and one with 10 times the thickness of the metal. It was determined that for an edge crack, under slow cooling conditions, the steady‐state value of G is the largest, and G is largest for equal thicknesses of ceramic and metal. For a center crack, a maximum transient G occurs which is larger than the steady‐state value and the strain energy release rate is smallest for equal thicknesses of ceramic and metal.